Infineon prepares for strong growth in mild hybrid vehicles

Infineon Technologies expects significant growth in automotive 48 V systems in the next few years and is working to expand its related power device portfolio. To meet the different needs of different 48 V systems, the chip maker will introduce new packages for its 80 V and 100 V MOSFETs using OptiMOS? 5 technology. In light of the expected increase in demand, Infineon has built a new production line in Dresden, Germany, to produce chips from 300 mm thin wafers.

Stephan Zizala, vice president of Infineon's automotive electronics division and general manager of the high-power business line, said: "In this decade, most newly produced cars worldwide will be partially or fully electrified. Market research shows that by Between 2030, the output of models using 48 V power supply systems and mild hybrid systems may increase more than tenfold. Therefore, in the product line for high-voltage systems for pure electric vehicles and fully hybrid vehicles and plug-in hybrid vehicles We will also strengthen our portfolio for 48 V systems by introducing new devices and expanding supply capabilities. "

Expand product portfolio to both ends of the power range

Infineon offers a variety of 80 V and 100 V MOSFETs with OptiMOS 5 technology. They have extremely low, scalable on-state resistances as low as 1.2 m ?. For core applications of light hybrid systems such as starter generators, battery switches and DC-DC converters, Infineon will expand its TOLx package series in order to meet their demand for high power density. This is based on the existing TOLL (TO leadless, 10 mm x 12 mm) package, which supports standard copper substrate PCBs and currents up to 300 A.

In addition, the series also includes a TOLG (TO Gull Wing Pin) package of the same size and an aluminum core insulated metal substrate (IMS). Due to the different thermal expansion coefficients of copper and aluminum, the use of IMS circuit boards under large thermomechanical stress will cause the solder joints between the package and PCB to withstand greater stress. To reduce this stress, the TOLG package uses gull-wing pins.

New package supports top cooling

Next, Infineon will add a third unique member to its TOLx package family: the TOLT (TO Top Cooling) package. It can dissipate heat by cooling on the top of the package rather than on the PCB. This can increase power by more than 20% and reduce the need for circuit board cooling. TOLT products are scheduled to begin mass production by 2021.

In addition, for fans and pumps that consume less power, and are increasingly turning to auxiliary equipment using 48 V power supply systems, Infineon will also expand its corresponding package portfolio. The new model is a small S3O8 package (3.3 mm x 3.3 mm) that supports small current applications up to 40 A. They complement the recently launched slightly larger SSO8 package (5 mm x 6 mm) that supports up to 100 A.

A mild hybrid system based on a 48 V power supply system allows car manufacturers to quickly and cost-effectively reduce CO2 emissions from their fleets. In addition, they can achieve more energy recovery than 12 V systems, and can use the recovered energy to support the electrical devices of the internal combustion engine. For safety and comfort functions such as stability control or air-conditioning compressors that rely on high current loads, the 48 V power supply also has advantages in performance and efficiency. Depending on the configuration of the power system and the number of auxiliary equipment, the light hybrid system can reduce carbon dioxide emissions by up to 15% compared to pure internal combustion engines.